Splint materials used in this study
| Material | Manufacturer | Composition | ||
|---|---|---|---|---|
| Autopolymerizing acrylic resin | GC pattern resin LS | GC Corp, Tokyo, Japan | dibenzoyl peroxide | 1 - 5% |
| methyl methacrylate (MMA) | 50 - 70% | |||
| ethyl methacrylate | 5 - 10% | |||
| accelerant | 1 - 5% | |||
| UV-light absorber | < 1% | |||
| dimethacrylate | < 1% | |||
| Light-polymerizing acrylic resin | Herifix | Heri Corp, Seoul, Korea | Silicon dioxide | 59% |
| Bisphenol“A”-bis-(2-hydroxypropyl)methacrylate | 36% | |||
| Diphenyl(2,4,6-trimethyl benzoyl)phosphineoxide | 1% | |||
| Diurethanedimethacrylate, mixture of isomers | 4% |
